DE-PACK designs Thermoformed Round Packaging Solutions with ESD Protection, tailored to your packaging requirements.
This thermoformed round packaging with ESD protection is used to pack a highly sensitive circuit boards. The thermoformed packaging is additionally provided with an antistatic, transparent lid made of PET, which protects the board from electrostatic charge and dust. This packaging solution was developed in close cooperation with the customer to ensure that the products are safe during transport between supplier and manufacturer.
| Product | Thermoformed Round Packaging with ESD Protection |
|---|---|
| Type | Produkt |
| Parent ProductGroup | Thermoformed Packaging |
| Sector | |
| Packaging-Type | |
| Packaging Property | ESD-Verpackung |
| Alternative Names | Antistatisch |
| Related | - |
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